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INTRODUCTION | ELECTRONIC CERAMIC CIRCUIT BOARD DIVISION
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Product Introduction
The most professional team,
R&D and production of dozens of PhDs.
Product Introduction
ELECTRONIC CERAMIC CIRCUIT BOARD DIVISION
- Substrate material
Tensky is composed of a group of innovative technology R&D engineers in ceramic circuit substrates. We aims to become the most advanced and professional ceramic substrate and leading manufacturer of ceramic circuit boards. It uses thin film DPC process, copper-clad DBC and AMB to provide customers with OEM/ODM services to solve Customers have various heat dissipation, high voltage resistance and other issues in the field of electronic circuits. -
Main materials
Al2O3 , AlN and Si3N4 substrate.
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Image layers metal
Ti, TiW, Cu , Ni, Pd , Au , Ag, AuSn, Sn, Al…and other metallize。
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Industry market
High-power LED brackets, refrigeration sheets, optical communication components, photovoltaic solar substrates, automotive electronics, biotech electronics, communications, aviation, satellite and military electronic circuit substrates, etc.
LED market: For special light sources and ultraviolet light sources, conventional products such as LED-COB integrated brackets, and UVLED brackets and other products are our main OEM specifications, we provide customers with professional advice to reduce the risk of customer testing and failure.
Automotive electronics: DPC and DBC provide high-power electronic modules for high-current and voltage designs. Biomedical electronics: DPC film pure plating provides stable electric frequency, and can also be designed to produce non-magnetic circuits to reduce the chance of interference.
Communications, aviation and satellites: We produce 3D three-dimensional circuits, circuit packaging and reduce substrate area, and improve electromechanical reliability.
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- Film surface
- Metallized material / design
Substrate Materials
Wafer Drawing
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INTRODUCTION
STRUCTURE AND PRECISION CERAMIC DIVISION
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INTRODUCTION
ELECTRONIC CERAMIC CIRCUIT BOARD DIVISION
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INTRODUCTION
COATINGS AND SURFACE TREARMENT DIVISION