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TECHNOLOGY | ELECTRONIC CERAMIC CIRCUIT BOARD DIVISION

  • Technology

    The most professional team,
    R&D and production of dozens of PhDs.

Technology Development
ELECTRONIC CERAMIC CIRCUIT BOARD DIVISION
  • Professional OEM
    • Ceramic metallized

      Ti/W,gold(Au), sliver(Ag),Copper(Cu),nickel(Ni)¡Kothers & produce final circuit

    • coating

      0.03um to 5mil

    • Ceramic Metallized substrate

      Al2O3 substrate metallized , AlN substrate metallized , Silicon wafer metallized

    • LED heat-dissipation ceramic substrate

      LED Al2O3 thin film substrate
      LED Al2O3 thick film substrate
      LED AlN thin film heat-dissipation substrate

    • Flip chip substrate

      The integration of the thin film,thick film,electrode plating and electroless plating processes

  • Production Process
  • Advance Technology
    01.Comparison of various circuit boards：
    02.Difference between thin & thick film patterns：
    03.The materials of conductivity：

    We have let LED heat dissipation substrate made the difference analysis between different process The process of thin film substrate with high equipment and technology, the collaboration of material development threshold, such as exposure, vacuum deposition, development, evaporation (Evaporation) , Sputtering (Sputtering) and electroless plating techniques, with the present market size, relatively high cost of film products, but once the market reaches a certain level, will be reflected in the cost structure, the relative in price Differences in thick-film process will be shortened substantially...

    In the high-performance, high product quality requirements and the high production of high-power LED frame moving trend of ceramic substrate, the high heat dissipation, high precision thin film ceramic substrate selection process will be the trend, in order to overcome the current thick film process Products can not be a bottleneck. Therefore, we can expect the gradual application of thin film ceramic substrates will be on the high-power LED and high-power LED with the rapid development of economies of scale, high-power LED at this time regardless of grain, thin-film ceramic substrate cooling, packaging and other production cost Will be significantly reduced, resulting in more speed high-power LED products quantified...

  • Metal adhesion test

    Our products have been tested 10 times, can withstand 3kgf over by tensile testing, so our quality is absolutely assured. Metallic adhesion resistance

    • Test date : 2010/06/10~2010/06/30
    • Test Item : LED Heat-Sink Substrate of 3535
    • Purpose : Ceramic substrate reliable thermal test to observe and the pulling affection
    • Condition : -40°C(30 min)~125°C(30min),500 cycle - (MIL-STD-202.107G)
    • Manner : The pulling machine to test adhesion
    • Standard : Pulling≧3Kgf。
    • Test result :
  • Product Development
    TSK Al2O3/AlN Product have：LED Al2O3/AlN Thin Film DPC Substrate

    1.We are also actively developing:Chip on Board of Ceramic Substrate (COB)/System Board of Ceramic Substrate.
    2.The COB product is packaged more Die in a chip inside , in the applications is the possibility of replacing the system board.
    3.COB surface coating materials can be produced according to customer demand Au or Ag.
    4.Currently we are actively involved in the development Cavity,It’s with a cup or the cube cavity of LED ceramic substrate (support)
    5.LED packaging factory to dispense more easily keep up with fluorescent powder, the product easy to use package
    6.The Cavity We are many different kinds of materials to test their stability
    7.Which contains aluminum, ceramic, Epoxy, K2 various other ways, to promote the convenience of a good package
    8.In addition we also made per customer’s requirements and objective recommendations, so to maximize the effectiveness of product.

    Application :
    1. High Power LED ceramic substrate
    2. Microwave (Wireless Communication & Radar)
    3. Semiconductor Process Equipment
    4. Solar Cell 5. Hybrid Electric Vehicles
    6.Flip chip/eutectic substrate 7.Sensor ceramic substrate.

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