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LED packaging, Fibre located, high-frequency communications, industrial applications of solar ceram

  •  LED packaging, Fibre located, high-frequency communications, industrial applications of solar ceram
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  • Information

     

    Ceramic circuit board has a resistance to high voltage, high current, fast heat dissipation, high thermal stability characteristics, such as the semiconductor industry, optical industry and mainframe devices, fiber-pass design, high-frequency communications, LED industry, solar industry, IC packaging, car electronic circuits, electronic circuit applications such as military maturing and growth.

     

     

    Introduction:

     

    This section ceramic circuit board design concept is a dedicated supply LED module plant, can be directly packaged

    chips directly Wire bonding brighter and longer life on the system board, because the ceramic heat with excellent

    results, but also allow your LED

     

    Product:

     

    Al2O3-ceramic system board

    AlN-ceramic system board

    Specifications:

    Thermal conductivity: Al2O3 - 23 ~ 27W/mk AlN - 170 ~ 230W/mk

    Palting: Ag, Ti, Au

    Size: high plasticity, Ke Yi partners to do a variety of different needs

    Thickness: 0.38mm, 0.5mm, 0.635mm, 1mm

    Load power: 27w or more

     

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